Silicon Thermal Conductive Absorber Series

 LiPOLY’s TEM series is a composite gap filler material with the functions of heat conduction and electromagnetic wave absorption. Thermal conductivity: 2.0~4.0 W/m*K for application frequency range 10MHz-77GHz. It has features of high flexibility and high compressibility. Customized die-cut and shape molding are all available. Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.

 

  • TEM96A
    Datasheet
  • TEM96B
    Datasheet
  • TEM96C
    Datasheet
  • Product Series Introduction

    Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.